Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications

Product Details
CAS No.: 65997-17-3
Environmental Protection: Yes
Function: Flame Resistance, Heat Resistance, Isolation
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  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
  • Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
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Basic Info.

Model NO.
JY20
Appearance
White Flowing Powder
Color
White
Product Name
Hollow Glass Microspheres
Product Appearance
White Flowing Powder
Product Features
Light Weight, Good Fluidity, Sound Insulation and
Application Area
FRP Products, Composite Foam Plastics, Sound Insul
Transport Package
Carton Packaging
Specification
15KG 20KG
Origin
China
HS Code
70182000
Production Capacity
50000

Product Description

Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications
Product specifications True density (g/cm ³) Bulk density (g/cm ³) Compressive strength (MPA/PSi) D50
(μm)
D90
(μm)
application area 
JY20 0.20-0.22 0.10-0.12 4/500 65 110 Logging, solid buoyancy materials, emulsion explosives, automotive repair putty, coatings
JY22 0.21-0.24 0.11-0.13 5/750 65 100 Logging, painting
JY25 0.24-0.27 0.13-0.15 5/750 65 100 Thermal insulation coatings, adhesives, solid buoyancy materials
JY28 0.27-0.30 0.14-0.17 10/1500 55 85 Oilfield cementing slurry
JY30 0.29-0.32 0.15-0.18 10/1500 55 85 Thermal insulation coating, solid buoyancy material
JY32 0.31-0.33 0.17-0.19 14/2000 45 80 Paint SMC/BMC, Adhesive, putty
JY35 0.33-0.37 0.18-0.21 21/3000 40 70 Oilfield cementing slurry, low-density drilling fluid
JY38 0.37-0.39 0.19-0.22 38/5500 40 65 Paint SMC/BMC, Bottom coat, solid buoyancy material
JY40 0.39-0.42 0.19-0.23 28/4000 40 70 Oilfield cementing slurry, low-density drilling fluid, thermal insulation coating
JY42 0.41-0.44 0.21-0.24 55/8000 40 60 Oilfield cementing slurry, low-density drilling fluid
JY46 0.44-0.48 0.23-0.26 41/6000 40 70 Oilfield cementing slurry, low-density drilling fluid SMC/BMC
JY50 0.48-0.52 0.25-0.27 55/8000 40 60 Oilfield cementing slurry, low-density drilling fluid
JY55 0.53-0.57 0.27-0.29 69/10000 40 60 Oilfield cementing slurry, low-density drilling fluid
JY60 0.58-0.62 0.29-0.34 82/12000 40 65 Oilfield cementing slurry, low-density drilling fluid
JY60S 0.58-0.63 0.30-0.34 125/18000 35 55 Modified plastics for vehicles, oilfield cementing slurry, drilling fluid
JYS38 0.37-0.39 0.19-0.22 38/5500 30 50 Composite circuit board SMC, adhesive
JYS42 0.40-0.44 0.21-0.24 55/8000 25 40 Rubber, shoe materials, adhesives SMC, Oilfield cementing slurry
JYS46 0.44-0.48 0.22-0.25 110/16000 20 30 5G plastic high-frequency high-speed copper plate
JYS60 0.58-0.62 0.27-0.30 193/28000 16 25 5G plastic high-frequency high-speed copper plate
JYS65 0.63-0.67 0.25-0.27 207/30000 13 20 5G plastic high-frequency high-speed copper plate
JYS70 0.68-0.72 0.25-0.27 207/30000 10 15 5G plastic high-frequency high-speed copper plate
It is widely used in FRP products, composite foam plastics, artificial marble, synthetic wood, sound insulation materials, putty, deep-sea buoyancy materials, bowling balls, low-density adhesives, sealing materials, lightweight resin crafts, mural hanging picture frames, sandwich layer structure of wallboards, electronic industry lightweight packaging materials, wave absorbing materials, lightweight concrete, emulsion explosives, etc.
Hollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide ApplicationsHollow Glass Microspheres with Low Density, Low Thermal Conductivity, Lightweight, and Wide Applications

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